IVH substrate
By using various VIA structures, we provide substrates tailored to your needs!
We would like to introduce the "IVH substrate" that we handle. It supports layer counts from 4 layers to 20 layers, and the VIA structure can accommodate various interlayer connections. It also supports ultra-small diameter VIAs. Additionally, it is compatible with impedance control and chip-on-hole, and we can provide various substrate materials tailored to different applications. 【Features】 ■ Layer count: Supports from 4 layers to 20 layers ■ VIA structure: Supports various interlayer connections ■ Supports ultra-small diameter VIAs ■ Supports impedance control ■ Various substrate materials available for different applications ■ Supports chip-on-hole *For more details, please refer to the PDF document or feel free to contact us.
- Company：三和電子サーキット
- Price：Other
